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The Nvidia 5090 Graphics Card is a theoretical next-generation GPU expected to follow the RTX 4090. Although it's not currently available, we can provide a general deep dive into the processes and technologies behind the production of cutting-edge GPUs like the RTX 5090 might involve. Here's a detailed look at the typical steps involved in creating high-end graphics cards:

Design & Architecture

The development of a graphics card starts with designing the architecture. Nvidia spends years researching and planning the underlying GPU architecture, usually introducing a new series every two years. The GPU architecture encompasses several major components:

GPU Core Design: Includes the organization of processing cores (CUDA cores for Nvidia), tensor cores, ray-tracing cores, and other specialized processing units.
Manufacturing Process: Nvidia collaborates with semiconductor manufacturers like TSMC or Samsung to determine the chip's manufacturing process. This usually involves choosing the transistor size, such as 7nm or 5nm, affecting the GPU's efficiency and power.
Memory Interface: Determining the type of VRAM (like GDDR6X), memory bus width, and memory capacity to handle massive textures and data.

Chip Manufacturing (Semiconductor Fabrication)

The heart of the graphics card is the GPU chip itself, which is fabricated using advanced semiconductor technology.

Silicon Wafers: Nvidia partners with companies like TSMC to create the GPU chip using silicon wafers, thin slices of purified silicon. Each wafer can yield hundreds or thousands of chips depending on size.
Photolithography: A light-sensitive chemical process prints tiny circuits onto silicon using ultraviolet light. For GPUs, extreme ultraviolet (EUV) lithography may be used for creating very fine details.
Transistor Formation: Layers of materials are deposited, etched, and refined to form millions or billions of transistors and connections in an incredibly dense pattern.

Chip Packaging

After manufacturing the chips, the process moves to packaging, where individual dies are separated, tested, and protected.

Wafer Cutting: The silicon wafer is sliced into individual GPU dies (chips) using laser cutting or diamond saw.
Die Sorting & Testing: Chips are tested for quality and performance, with only high-performing chips making it to the top-tier products.
Substrate Attachment: Each die is attached to a substrate, a special board that connects the chip to the rest of the graphics card. Packaging can include features like multi-chip modules (MCM) if multiple dies are integrated.

PCB Design & Assembly

The graphics card's Printed Circuit Board (PCB) is carefully designed to house the GPU and other critical components.

PCB Layout: Engineers lay out the pathways for electrical signals, power delivery, and communication between components like VRAM, VRMs, and power phases.

Cooling System Development

A high-performance GPU like the theoretical RTX 5090 requires an advanced cooling solution to manage heat from the powerful components.

Heatsink Design: Copper or aluminum heatsinks are designed to draw heat away from the GPU and other hot components. Fins and heat pipes optimize heat dissipation.
Fans: High-quality fans, often with a dual or triple-fan configuration, ensure adequate airflow. Some high-end GPUs also use vapor chambers, which improve heat transfer.
Water-Cooling: High-end versions may include water blocks for custom water-cooling solutions or hybrid air/water coolers.

Assembly & Integration

After components are prepared, the card is assembled and undergoes rigorous testing.

Component Installation: The GPU chip, VRAM, cooling system, and other components are carefully installed on the PCB.
Thermal Paste & Pads: Thermal interface materials (TIM) like paste or pads are applied to improve heat transfer between components and the cooling system.
Bracket & I/O Ports: The backplate and external I/O ports (like HDMI, DisplayPort) are installed, along with any support structures

Quality Control & Testing

Automated Testing: Tests for stability, power consumption, clock speeds, and temperature management. Each GPU might be tested for performance using benchmarks.
Burn-In Testing: Cards may be stressed for extended periods to ensure stability under extreme conditions.
Sorting & Binning: Cards are sorted by performance and thermal efficiency. High-performing chips might be reserved for factory overclocked versions or “Founder’s Editions.”


OUTLINE:

00:00:00 Architecture and Key Technologies
00:01:49 The Journey of a GPU
00:02:27 Assembling the 5090
00:03:00 Keeping the Beast in Check
00:03:33 Ensuring Peak Performance
00:04:03 Packaging and Distribution
00:04:35 Ensuring Peak Performance
00:05:05 5090 and Beyond
00:05:37 The 5090's Impact on Other Industries
00:06:17 What it Means for Gamers and Creators
00:06:56 A New Era of Visual Computing