Thermal design power
0Thermal design power, by Wikipedia https://en.wikipedia.org/wiki?curid=1012800 / CC BY SA 3.0
#Computer_engineering
#Heat_transfer
The thermal design power （TDP）, sometimes called thermal design point, is the maximum amount of heat generated by a computer chip or
component （often a CPU, GPU or system on a chip） that the cooling system in a computer is designed to dissipate under any workload.
Some sources state that the peak power rating for a microprocessor is usually 1.
5 times the TDP rating.
Intel has introduced a new metric called scenario design power （SDP） for some Ivy Bridge Y-series processors.
The average CPU power （ACP） is the power consumption of central processing units, especially server processors, under "average" daily usage as defined
by Advanced Micro Devices （AMD） for use in its line of processors based on the K10 microarchitecture （Opteron 8300 and 2300 series processors）.
Intel's thermal design power （TDP）, used for Pentium and Core 2 processors, measures the energy consumption under high workload; it is numerically somewhat higher than the "average" ACP rating of the same processor.
According to AMD the ACP rating includes the power consumption when running several benchmarks, including TPC-C, SPECcpu2006, SPECjbb2005 and STREAM Benchmark （memory bandwidth）,
which AMD said is an appropriate method of power consumption measurement for data centers and server-intensive workload environments.
AMD said that the ACP and TDP values of the processors will both be stated and do not replace one another.
Barcelona and later server processors have the two power figures.
The TDP of a CPU has been underestimated in some cases, leading to certain real applications （typically strenuous, such as video encoding or games） causing the CPU to exceed its specified TDP and resulting in overloading the computer's cooling system.
In this case, CPUs either cause a system failure （a "therm-trip"） or throttle their speed down.
Most modern processors will cause a therm-t...
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