Glass substrates could be the key to linking up massive multi-chiplet processors of the near ish fut

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Glass substrates could be the key to linking up massive multi-chiplet processors of the near(ish) future.

as Dai Nippon Printing has already talked, up the benefits of this material for semiconductors

The line requires all sorts of different, technologies to create the new glass substrates, including those from flat panel display manufacturing, Intel's own EMIB interconnect manufacturing, and organic substrate manufacturing



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Tags:
Glass substrates could be the key to linking
up massive multi-chiplet processors of the nearish future
Technology News
GOLAHURA
as Dai Nippon Printing has already talked
up the benefits of this material for semiconductors
The line requires all sorts of different
technologies to create the new glass substrates
including those from flat panel display manufacturing
Intel's own EMIB interconnect manufacturing
organic substrate manufacturing
In a briefing with Rahul Manepalli