Abstracts: Heat Transfer and Deep Learning with Hongxia Hao and Bing Lv
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Published on ● Video Link: https://www.youtube.com/watch?v=F1zmO9ntiQA
Silicon has long borne the burden of heat transfer in electronics, but in a post-Moore’s Law world, researchers like Hongxia Hao and Bing Lv are using AI to discover and design next-generation materials that exceed the limits of silicon’s thermal conductivity.
Show notes: https://www.microsoft.com/en-us/research/podcast/abstracts-heat-transfer-and-deep-learning-with-hongxia-hao-and-bing-lv/