Duration: 32:03

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This is an audio version of the Wikipedia Article:
https://en.wikipedia.org/wiki/Thermal_management_(electronics)


00:00:40 1 Overview
00:00:49 1.1 Thermal resistance of devices
00:02:23 1.2 Thermal time constants
00:03:05 1.3 Thermal interface material
00:03:38 2 Applications
00:03:47 2.1 Personal computers
00:04:56 2.2 Soldering
00:05:45 2.3 Batteries
00:06:21 3 Methodologies
00:06:31 3.1 Heat sinks
00:08:03 3.2 Cold plate
00:08:57 3.2.1 Principle
00:10:24 3.2.2 Construction and materials
00:12:41 3.2.3 Performance
00:13:57 3.3 Convective air cooling
00:14:27 3.4 Forced air cooling
00:15:00 3.5 Heat pipes
00:16:28 3.6 Peltier cooling plates
00:17:44 3.7 Synthetic jet air cooling
00:18:46 3.8 Electrostatic fluid acceleration
00:19:59 3.9 Recent developments
00:20:29 4 Thermal simulation of electronics
00:21:13 4.1 Design
00:22:05 4.2 Optimise
00:22:55 4.3 Verify
00:23:59 4.4 Software
00:24:19 5 Telecommunications environments
00:27:32 5.1 Equipment cooling classes
00:30:40 5.2 Economic impact
00:31:29 6 See also



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SUMMARY
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All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. The amount of heat output is equal to the power input, if there are no other energy interactions. There are several techniques for cooling including various styles of heat sinks, thermoelectric coolers, forced air systems and fans, heat pipes, and others. In cases of extreme low environmental temperatures, it may actually be necessary to heat the electronic components to achieve satisfactory operation.