MediaTek Dimensity 8250: What's New?
2MediaTek Dimensity 8250: What's New?
MediaTek has unveiled its latest offering in the mobile chipset arena: the Dimensity 8250, a revamped version of the Dimensity 8200 chipset introduced in late 2022. Renowned for its innovative approach to mobile hardware, MediaTek continues to push the boundaries of technological excellence with this latest release.
Maintaining the cutting-edge 4nm fabrication process pioneered by its predecessor, the Dimensity 8250 boasts significant improvements while staying true to its mid-range roots. Powered by four Cortex-A78 cores, clocked at 3.1GHz for one core and 3.0GHz for the remaining three, alongside four Cortex-A55 cores clocked at 2.0GHz, this chipset delivers exceptional performance and efficiency for everyday tasks and multimedia experiences.
The Mali-G610 MC6 GPU configuration ensures smooth graphics rendering and immersive gaming experiences, while the display driver supports FHQ+ displays at 180Hz or QHD+ displays at 120Hz, offering users unparalleled visual clarity and fluidity.
In terms of memory and storage, phones equipped with the Dimensity 8250 can harness the power of quad-channel LPDDR5 RAM, clocked at speeds of up to 6,400Mbps, and UFS 3.1 storage, providing lightning-fast data access and seamless multitasking capabilities.
On the camera front, the chipset's ISP excels at HDR processing in 14-bits and supports sensors of up to 320MP or three 32MP cameras simultaneously. With features such as 2x lossless zoom and 4K video recording at up to 60fps, users can capture stunning visuals with exceptional detail and clarity.
Moreover, the Dimensity 8250 integrates built-in AV1 decoding, HDR10+ Adaptive support, and SDR-to-HDR conversion with AI-driven noise reduction for videos, ensuring an unparalleled viewing experience for multimedia content.
Continuing MediaTek's commitment to connectivity, the Dimensity 8250 features a built-in 5G modem capable of delivering blazing-fast downlink speeds of up to 4.7Gbps. Local connectivity is further enhanced by three-band Wi-Fi 6E (ax, 2x2) and Bluetooth 5.3, offering seamless connectivity across various devices and networks.
Furthermore, the chipset incorporates the MediaTek APU 580 for AI computation, optimized to operate in short bursts to minimize thermal issues and power consumption, thereby ensuring optimal performance and efficiency.
The eagerly awaited Dimensity 8250 chipset is set to make its debut with the upcoming Oppo Reno12, scheduled for release on May 23. With its exceptional performance, innovative features, and unparalleled connectivity, the Dimensity 8250 is poised to revolutionize the mobile computing landscape. Don't miss out on the opportunity to experience the future of mobile technology—stay tuned for the Dimensity 8250-powered devices hitting the market soon.