AMD REDEFINES Zen CPUs With X3D STACKED Dies - Milan X | Mesh Shaders REVOLUTIONIZES Gaming Says Dev

AMD REDEFINES Zen CPUs With X3D STACKED Dies - Milan X | Mesh Shaders REVOLUTIONIZES Gaming Says Dev

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AMD Redefines Zen CPUs With X3D STACKED Dies - Milan X | Mesh Shaders REVOLUTIONIZES Gaming Says Dev

Some very interesting new leaks for AMD CPUs has leaked today, with X3D stacked dies. This new packing technology for their Zen processors would be a hybrid design. According to leakers, the first product we will see launch with this will be Milan X. We go over all the leaked information for the Zen X3D stacked dies, including of course any known performance targets and what improvements we could see brought to the table by the new packaging technology for Zen processors.

While the X3D stacking technology that we will allegedly see in Milan X is initially planned for the data center, it still shows AMD's potential plans for the future of their Ryzen roadmap. Of course, the Zen 3 Ryzen 5000 processors currently use a chiplet based design, but AMD are continuing to be very aggressive in their push to stay dominant against Intel in gaming and workload performance. The new die stacking tech could be just one of the ways Zen will continue to be pushing the bleeding edge for data centre and desktop CPUs.

We also have an update for FidelityFX Super Resolution / FSR, and some very interesting comments from a developer on the importance of mesh shaders. We have discussed mesh shading multiple times on this channel, and they are poised to be a truly revolutionary piece of technology that could change gaming forever on both PC and Xbox.

LINKS
https://twitter.com/ExecuFix/status/1397152544678457347
https://twitter.com/patrickschur_/status/1397148927590236161
https://developer.nvidia.com/blog/realistic-lighting-in-justice-with-mesh-shading/

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0:00 Start
0:10 Zen X3D stacked dies
7:14 FSR
9:06 Mesh shaders




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